Ufs 3.1 Pinout [updated] Jun 2026
is the standard for high-performance embedded storage found in flagship smartphones (e.g., Samsung Galaxy S21/S22, OnePlus 9/10) and automotive systems. Unlike eMMC, UFS uses a full-duplex serial interface (MIPI M-PHY) supporting separate read and write lanes, offering theoretical speeds up to 2,900 MB/s.
UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global ufs 3.1 pinout
The UFS 3.1 interface uses a MIPI (Mobile Industry Processor Interface) M-PHY physical layer, which is a high-speed, low-power interface standard. The UFS 3.1 pinout consists of: is the standard for high-performance embedded storage found
Different manufacturers (Samsung, Kioxia, SK Hynix) may rename these. Common alternatives: The UFS 3
UFS 3.1 does not use a traditional command (CMD) line like eMMC. Instead, commands are embedded in the data stream using the UniPro protocol stack. The separate "CMD" ball on some pinout diagrams is often a strapping pin or unused.
| Pin(s) | Symbol | Description | Importance | | :--- | :--- | :--- | :--- | | A2, A3, A4, B1, B2, B3, B4, C1, C2, C3, C4 | | NAND Core Supply – 2.5V to 3.6V (typically 3.3V). Supplies power to the NAND flash array. High current draw during writes. | Critical | | D1, D2, D3, E1, E2, E3, F1, F2, F3, G1, G2, G3, G4 | VCCQ | Controller & I/O Supply – 1.14V to 1.26V (typically 1.2V) or 1.8V. Powers the UFS controller core and M-PHY. | Critical | | A1, K4, L4, M4, N1, N2, N3, N4, N5, N6, N7... | VSS | Ground. All VSS balls must be connected to a solid ground plane. | Critical | | H4, J4 | VCCQ2 | Optional second I/O supply for legacy compatibility. Usually tied to VCCQ. | Low |
Universal Flash Storage (UFS) 3.1 is an advanced storage standard developed by the JEDEC Solid State Technology Association to meet the high-bandwidth and low-latency demands of 5G smartphones, automotive systems, and IoT devices. By utilizing the MIPI M-PHY physical layer and UniPro link layer, UFS 3.1 achieves sequential read speeds of approximately 2100 MB/s, representing a significant performance leap over older standards like eMMC. 1. Physical Interface: The BGA153 Footprint